Invisipin®

Application Notes

RDIS high performance mezzanine solutions offer the opportunity to utilize the top of the mother board and bottom of the daughter card surfaces for routing and components. Similar to our B2B solutions, these mezzanine structures are not limited to thickness, dimension or pitch. If you have a need to raise the DC above the surface of its mating board, this is the answer. For extra performance options, coaxial via’s can be incorporated into the mezzanine as a means of insuring a higher performing signal transfer.