Invisipin®
E/C Board to Board
Application Notes
As with our standard B2B interconnects, R&D Interconnect Solutions offers a version with components embedded within the carrier or substrate. This feature allows for delivery of specific power requirements to individual pins of your device, with embedded and / or stacked embedded capacitors, at a dimension closer than any other application available. If your needs are for termination, the RDIS EC-B2B solution can be engineered to install a terminating resistor in the substrate which allows for termination essentially at the socket pin! These include our newest pin product, the INVISIPIN® individual, solderable elastomer pin, with <1 dB loss at 50 GHz, <20 g force per pin, up to 3.5 Amps per pin (0.8mm pitch @ 125C)
